CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
Thermal Adhesive Tape with Extremely Low Thermal Resistance Reflects Synergistic Innovation Between DuPont and its Laird Performance Materials Acquisition
The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
Osaka, Japan - Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of … [Read more...]
Protect Electronic Components with Dam & Fill
Sensitive electronic components mounted on a circuit board often require protection from exposure to harsh environments. While there are several ways to accomplish this, the dam and fill method offers many benefits. Dam-and-filling entails dispensing the damming material around the area to be encapsulated, thereby restricting the flow of the fill from spreading to other parts … [Read more...]
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