According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
Enhanced Power Cycling Thermoelectric Modules Provide 1 Million Temperature Cycles
Global technology leader Laird has improved its advanced PC Series Power Cycling thermoelectric module (TEM) for applications that require high reliability and high volume thermal cycling between multiple temperature set points. The enhanced PC Series is now proven to perform more than 1-million temperature cycles, extending the mean time between failure (MTBF) in molecular … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
How to Choose the Right Solution for Effective Heat Management
(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
- « Previous Page
- 1
- …
- 7
- 8
- 9
- 10
- 11
- 12
- Next Page »