Thermal solutions developer Phanteks has released the PH-TC90LS, an ultra-low profile thermal radiator for CPU cooling in a compact environment. The PH-TC90LS heat sink measures 27mm tall—34mm when the bundled fan is attached—and is compatible with small form factor cases with a 45mm clearance. The fan is equipped with a pulse-width modulation (PWM) controller and can generate … [Read more...]
Heat Sinks for Use in High-Power Semiconductor Devices
Electronics component manufacturer Ohmite has released the CP4 Series of cold plate four-pass heat sinks for use in SCRs, rectifiers, diodes, thyristors and other high-power semiconductor devices for variable speed drive, power supplies, robotics and motor controls applications. The CP4 Series heat sinks weigh approximately 805 grams, are made of copper and aluminum and come … [Read more...]
Growing Use of Tablets May Foreshadow Change in Heat Sink Industry
In the earliest days of personal computing, excess heat wasn’t a problem; any heat that was generated by the computer dissipated safely into the surrounding air. Even in the 1980s, a single fan was all that was needed to ventilate the entire inside case of the computer. However, as faster computer processors continued to develop, fans were no longer enough to maintain an ideal … [Read more...]
Broader Adoption of Vapor Chamber Technology
Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. Horizontal Vapor Chambers spread heat eight times faster than solid copper, eliminating hot … [Read more...]
New Heatsink Supports More Package Sizes
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink … [Read more...]
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