Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Thermally Conductive Grease Used for Solar Industry
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2). It provides high thermal conductivity and low thermal resistance for applications where … [Read more...]
Connector/Decoupler Integrated in a Heat Sink
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from each other and function as radiators that dissipate heat from the stacked semiconductor chips. Conductive wiring structures are formed on each set of … [Read more...]
Niagara Thermal Products Acquires Thermshield
Niagara Thermal Products LLC’s acquisition of Thermshield, LLC brings together two companies in the design and supply of custom thermal solutions across a wide range of markets and applications. Niagara Thermal and Thermshield will continue to operate as separate business entities but will work together to evaluate integration opportunities in a thoughtful and well-planned … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 2
These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the combined package/heat sink assembly and compare it to the requirements of the … [Read more...]
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