Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished assemblies. Ideal for precision form-in-place gaskets, encapsulation, coating, EMI and thermal grease applications, underfill and … [Read more...]
B-Staged Adhesive Film for Bonding and Sealing Applications
A new high temperature-resistant B-staged adhesive film is available from Master Bond for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. FLM36 film adhesive can withstand temperatures up to 500°F, offers good electrical insulation, and retains its high strength properties upon prolonged exposure to elevated … [Read more...]
Thermal Pads Enhance LED/Luminaire Performance
Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes … [Read more...]
Thermal Adhesive Tape for Application to Unprocessed PCBs
Thermal management materials manufacturer Universal Science has introduced a new thermal adhesive tape designed to be applied to FR4 or insulated metal substrate printed circuit boards (PCBs) prior to processing as a replacement for mechanical fixings. Featuring a thermal conductivity of 2.0 W/mK and a breakdown voltage (electrical isolation) of 4 kV AC, Bondline 2000-REFLOW … [Read more...]
Discovery Could Change Textbook Models on Heat Transfer
A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s Center for Condensed Matter reportedly found ballistic thermal conduction by phonons at room temperature along silicon-germanium nanowires. While … [Read more...]
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