NuSil Technology, a manufacturer of silicone materials for the medical, aerospace, electronics and engineering markets, has released R-2165, a new silicone solution for the protection of electronic components and systems such as sensors, relays and connectors. “R-2165 is the latest addition to NuSil’s diverse portfolio of silicones designed for potting and encapsulating … [Read more...]
'On-Demand' Nano-sized Heat Sinks Lower IC Temperatures
Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
Stamped CPU Heat Sink Cools High Power Components
Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik. According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
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