Thermal solutions provider JMC products has released two new counter-rotating fans measuring 40x50x32mm and 40x50x38mm for high-density 1U servers, power supplies and high-density electronic enclosures. Both fans feature a speed of 10,200 rpm and pulse width modulation (PWM) control for both motors individually or simultaneously. … [Read more...]
Data Center Liquid Cooling Process Wins Energy Efficiency Award
The Uptime Institute has recognized 3M Company, Iceotope Research and Development Ltd. and the University of Leeds in the UK as joint-Green Enterprise IT (GEIT) award winners for their development of new data center liquid cooling methodologies designed to improve energy efficiency in data servers. Based in New Mexico, the Uptime Institute offers education, consulting, … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
DuPont Increases Thermal Substrate Production to Accommodate Demand
DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Two Thermally Conductive Compounds Added to TIM Product Line
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
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