Microsanj, LLC, a supplier of high resolution, thermoreflectance thermal imaging systems, tools and services, has announced the availability of a new addition to the Nanotherm series of thermoreflectance thermal imaging products. The NT100A General Purpose Thermoreflectance Thermal Imaging System was featured last month at SEMI-THERM 2013 in San Jose, Calif. The new thermal … [Read more...]
Software Suite Handles Massive Data Flows Generated by Thermal Sensors
LumaSense Technologies, a developer of temperature and gas sensing devices, has released LumaSpec R/T, a new industrial analytics software for thermography. According to the company, the new software “introduces real sensor graphics process intelligence to manage massive data flows generated by thermal imaging and other sensors.” The new software suite consists of four … [Read more...]
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and commercialize next-generation, multiphase thermal management systems for electric vehicle (EV) battery and light emitting diode (LED) … [Read more...]
Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, … [Read more...]
- « Previous Page
- 1
- …
- 160
- 161
- 162
- 163
- 164
- …
- 351
- Next Page »