Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC 0.6mm-high HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm2. At 85°C, the eTEC HV56 can … [Read more...]
IMS Research Estimates LED Market Shares for 2009 and 2010
In a new report updating market shares for 2009 and provisional market share for 2010, IMS Research says 2010 was a year of tremendous growth in the LED industry, dramatically higher than the typical growth rates of recent years. The researchers estimate the market for LEDs has grown from $6.1 billion in 2009 to about $10 billion in 2010, driven by economic recovery, lighting … [Read more...]
Chevy Volt’s Cooling Systems Include Power Electronics Coolant Loop
A GM article explaining the Chevrolet Volt’s cooling/heating systems notes that the power electronics coolant loop is designed to insure the main underhood electronics do not overheat during use. It is essential that the heat developed by the power inverter module and the plug-in battery charger while operating the Volt or when plugged in be dissipated in order to prevent … [Read more...]
ElectronicsCooling Winter 2010 Issue
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Winter 2010 issue here. … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
- « Previous Page
- 1
- …
- 258
- 259
- 260
- 261
- 262
- …
- 351
- Next Page »