NMB Technologies Corporation introduces a new series of informational engineering papers on how thermal simulation can aid, not only in the design of a system, but in anticipating the behavior of cooling components. In looking at the selection process of cooling components, in particular axial cooling fans, the first step for the engineer is to estimate the required airflow … [Read more...]
Hybrid’s Liquid System Allows Chevy to Offer Cool Warranty
The liquid heating and cooling system in the Chevrolet Volt battery not only enabled General Motors Co. to offer a long warranty of eight years or 100,000 miles, but it also gave engineers more room for battery cells since it’s more compact than air-cooled systems, but it also. Standard auto coolant circulates through 144 metal plates, called fins, between each of the Volt … [Read more...]
The Uses of Simplicity in Thermal Analysis
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system complexity; 2) increased power dissipation; and 3) enhanced software tools and computing performance. The first two we put into the challenge category. They … [Read more...]
Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment
The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given heat load, or allow higher component heat dissipation at a given temperature level. Readers who are unfamiliar with TE cooling … [Read more...]
Thermal Facts and Fairy Tales: Uncertainty is Assured
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of a printed circuit board had determined that a thermal interface material was needed under some hotter components to provide a better conduction path. The circuit card was edge cooled … [Read more...]
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