Introduction This paper will discuss a new approach to the measurement of the thermal properties of PCBs and the packages mounted to them. It is intended to replace traditional solutions, such as using thermocouples and data acquisition equipment. The basic idea of this approach is that the IC chips themselves will be used to measure and acquire temperature data. It will be … [Read more...]
Forced convection cooling inside an electronics enclosure
Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and a cooling fan. This problem becomes more difficult when there are multiple heat sinks and other large components arranged in an arbitrary manner inside … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
Pressure drop coefficients for thin perforated plates
Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations - some of which are impossible to evaluate quickly - must then be addressed. To simplify this issue for the reader, this month's Technical Data page has been designed to provide an overview of this information. When focusing on … [Read more...]
The thermal conductivity of silicon
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required. For steady state thermal analyses at the board and system level, however, accurate values are not required, because … [Read more...]
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