Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]
The Appification of CFD Simulation has Started
There has been much talk about the appification of established technologies. Discussion on the appification of high-value CAE simulation seems to have focused on the fact that it's a when, not if. How such a conclusion has been made without a clarification of what 'appification' actually is, is confounding. Apps are cheap, limited in the scope of their application and, as a … [Read more...]
Protection Coatings for Coolers to be Presented at Upcoming Conference
On February 26 at the Photonics West Conference in San Francisco Rogers Corporation’s Power Electronics Solutions (PES) will be presenting a report on ACT’s vapor-deposited Applied Nanoscale Corrosion Resistant (ANCER™) coatings in partnership with Advanced Cooling Technologies. According to the company, the thin, conformal ANCER coatings “help extend the operating life of … [Read more...]
“Breakthrough Products of the Year” Award Winner
Enclosure manufacturer, Rittal Corporation, has won Processing magazine’s 2015 Breakthrough Products of the Year award for their Blue e+ Cooling Unit Series for enclosures. “The award recognizes products, technologies and services that have made significant contributions to the process industries within the last year and are expected to continue impacting the market in the … [Read more...]
Room Temperature Metal Bonding – Heralding a Revolution In IC Performance and Reliability?
A reliable electronic product is generally a cool one. In addition, one of the main limiters of non-functional performance is operating temperature. Keep your product cool and it will last longer and/or operate faster. Electronics thermal management has been dogged by thermal resistances at part/part interfaces for decades. Reduce these main bottlenecks in the heat flow path … [Read more...]
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