(July 14, 2016) Recently Raytheon has developed a “SiC-based high-temperature small-form-factor power module for electrical switching in harsh environments,” according to Semiconductor-Today.com. Semiconductor-Today reported that, “A prototype module that includes two 1200V silicon carbide (SiC) bipolar junction transistors (BJTs) has currently amassed more than 1000 hours of … [Read more...]
Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements
Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the implications of subjecting thermal requirements on suppliers or coworkers. A rush to get a quick answer or to use the latest feature in an analysis software code … [Read more...]
New Software Creates Heat Sink Geometries
From Cradle, HeatDesigner is a fast, efficient, and easy to use thermal analysis tool for electronics cooling. It includes a one time saving feature, a Parametric Study Tool, and plate heat sink creation. With a few inputs, the shape of pin or plates fins, and their orientation and spacing are quickly created. HeatDesigner models can contain 100 million elements so the flow … [Read more...]
New Cooling Fan Blade Design
Cradle has released their new simpler, faster solution for fan design, SmartBlades. SmartBlades simplifies axial cooling fan design by automating generation of blade geometry CAD data. Engineers adjust parameters for blade number, profile, and twist. Shape information can be output in Parasolid XT format compatible with most CAE software. Or seamlessly import it into Cradle … [Read more...]
Thermal Simulation Tool for Design Engineers Available
In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes to circuit board design affect thermal performance, thus reducing downstream rework. Analysis data can be passed seamlessly from the PCB … [Read more...]
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