Introduction Developments in solid state lighting (SSL) in recent years have led to an extensive increase in the driving current of light emitting diodes (LEDs). Although corresponding increases in light output and efficiency has also been noted, current lighting design applications require the implementation of multiple diodes to allow its utilization in universal lighting … [Read more...]
Cloud Computing May Solve Data Center Cooling Cost Issues
InformationWeek Reports, a service provider for peer-based IT research and analysis, recently released its “2012 State of the Data Center” report, which contains the results of its annual State of the Data Center Survey and advice on how companies can best approach the virtualization of hardware and software. According to the data compiled from approximately 256 business … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1
Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]
Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction
Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which strongly influence the performance, reliability and efficiency. A significant modeling issue is to obtain a compact but … [Read more...]
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