Thermal analysis tools available to engineers and scientists offer a wide variety of methods to solve problems. A cursory review of the past decade’s issues of ElectronicsCooling magazine can show methods ranging from analytical techniques (such as hand calculations) to spreadsheets to full numerical/computational solutions such as CFD (Computational Fluid Dynamics) and FEA … [Read more...]
Using Simulation to Improve Data Center Efficiency
This paper describes a new CFD-based modeling capability and design methodology that overcomes the limitations of conventional guidelines and traditional CFD-based approaches and is effective at addressing equipment related cooling and efficiency problems in the data center. Depending on circumstances, 30-50% improvement in cooling system efficiency can be achieved by this … [Read more...]
LED Design Case Study: Lighter Thermal Management with Simulation
Future Facilities Incorporated recently released a case study showing that its new CFD software for electronics cooling design, 6SigmaET, solves the problem of how to shrink electronics devices that generate heat. The study describes how Advanced Thermal Solutions-Europe, BV used Future Facilities’ 6SigmaET software to model lamp performance while simultaneously reducing heat … [Read more...]
Software-Connected Hardware Platform Provides Enhanced Measurement
Corsair’s new Link™ technology allows multiple Corsair products to be connected to the Corsair Link Controller, providing enhanced measurement and control capabilities. Corsair products that includes a Corsair Link connector can be linked to the Controller and report key parametric data, such as temperature, fan speed, pump speed, voltage, power consumption, etc., which can … [Read more...]
Software Modeling to Determine Heat-Related Problem Spots
Managing heat generation and dissipation in today’s compact and complex electronic world requires the attention of designers and manufacturers alike. It is also a system-wide problem, because optimizing a thermal problem in one area—whether it’s package, board or enclosure—rarely ensures the entire system will be optimized. Past techniques to determine heat-related problem … [Read more...]
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