In and effort to increase the options available to thermal engineers in the growing market for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) recently premiered its SDP-5040-A/B Gap Filler product. The non-adhesive product is part of the high performing SDP Series which are Two … [Read more...]
New Thermally Conductive Interface Material Announced
Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and no bleeding. It is designed to dissipate heat away from electronic components such as semiconductors and temperature sensing … [Read more...]
Self-Healable Electronic Material That Can Help Prevent Overheating
(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding physical deformation such as being cut in half, naturally repair themselves with little to no external influence.” “Researchers have … [Read more...]
Graphene Nanoflakes Better Dissipates Electronics’ Heat
(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments in which they managed to increase the efficiency of heat transfer by 76 per cent” – the kind of results that suggest … [Read more...]
Thermal Innovations Win Award and Industry Recognition
(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the Solder Materials category for its Loctite® GC 3W material, and won the Underfill/Thermal Interface Materials category for its Gap Pad® EMI 1.0 … [Read more...]
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