Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and … [Read more...]
Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation
Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and good insulation with a thermal conductivity of 4 W/m-K, working temperature of -40°C to 105°C and tensile strength of 2 Kgf/mm2. … [Read more...]
Expanded Product Catalog Features New Thermal Interface Materials
Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several new pages of high-performance, low-cost thermal materials have been added to complement the company’s current … [Read more...]
Thermal Pad Offers Advantages of Thermal Grease Without Mess
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of thermal expansion (CTE) deficiencies. Naturally tacky with no adhesive, fiberglass or other non-conductive … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
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