Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be tested in its application to conclude its merits. Standardized testing is useful, however, for comparing TIMs in research and … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
PCMA Thermal Interface for Intel Core LGA-115x Processors
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a phase-change metallic alloy (PCMA) which reflows and fills surface asperities on the CPU lid … [Read more...]
New Ultrathin Material May Lead to Better Thermally Conductive Coatings
Scientists at Kansas State University have discovered a new ultrathin electrically conductive material they say may lead to advances in the efficiency of electronic and thermal devices. Vikas Berry, the William H. Honstead professor of chemical engineering, and his colleagues found that manipulating molybdenum disulfide (MoS2)—a three-atom-thick inorganic compound … [Read more...]
Highly-Conformable Gap Filler Pad with Reinforced Mesh Center
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas. Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of 0.40 … [Read more...]
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