Sponsored by FLIR Whether the goal is product testing or scientific research, heat can be an important indicator of how a system is functioning. The FLIR ETS320 is a non-contact thermal measurement system that pairs a high-sensitivity infrared camera with an integrated stand, for hands-free measurement of printed circuit boards and other small electronics. Download the … [Read more...]
Thermal Imaging Camera for Electronics Development and Testing Launched
FLIR Systems, Inc. announced the launch of the FLIR ETS320 thermal imaging solution for electronics testing in engineering benchtop environments. As the first FLIR camera designed specifically for benchtop work in testing and analyzing the thermal characteristics of electronic components and printed circuit boards (PCBs), the FLIR ETS320 aims to advance testing and diagnosis … [Read more...]
New Low Power Consumption Fan Released
SANYO DENKI has developed and launched the San Ace 120 9GA type 120 x 120 x 25 mm low power consumption fan. It features industry-leading energy efficiency and static pressure. (This information is based on our own research as of January 12, 2017, collected among 120 × 120 × 25 mm axial DC cooling fans.) It is suitable for use in medical equipment, electrical measuring … [Read more...]
Recent Research in TIMs
Please find below some recent research in Thermal Interface Materials (TIMs). Low melting alloy composites as thermal interface materials with low thermal resistance Haoran Wen, Yaqiang Ji Kai Zhang, Matthew M.F. Yuen, S.W. Ricky Lee, Xian-Zhu Fu, Rong Sun & Ching-Ping Wong Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal … [Read more...]
Fix Your Electronics Cooling Problems with Autodesk
Join Autodesk's "Fix Your Electronics Cooling Problems" webinar on April 6th, 2:00 pm ET. Electronics used within products are constantly changing and improving, but the need to ensure proper cooling of these components remains. To maximize product performance, engineers need to overcome common electronics cooling challenges like: Reduction in product size Increase … [Read more...]
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