Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a unique refrigerator. TECs find application [1, 2] in many fields from simple food and beverage coolers for an afternoon picnic to extremely … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or wall-mount base stations and radio units, include external fins to improve natural convection and radiation heat transfer rates. Early … [Read more...]
Reader Poll Declares ElectronicsCooling a Winner!
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John McCain is the clear winner of the Republican nomination for president, as I draft this column, the contest between Senators Hillary Clinton and Barack Obama to win the … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
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