Articles Archives | Page 167 of 176

Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow

January 1, 1998 E. R. Meinders

Figure 1: Sketches of the measurement cube. Introduction Computational fluid dynamics (CFD) codes are frequently used as design tools to predict the thermal processes in electronic circuitry. CFD codes can easily cope with a high level of complexity (component, board and system levels) which makes them attractive to use. However, the thermal and kinematic complexity of the … [Read more...]

Convection and radiation

January 1, 1998 Bruce Guenin

In last issue's calculation corner,a simple 1-dimensional conduction calculation was described. This time, we look at the other two basic heat transfer processes, namely convection and radiation. In actual applications with multiple heat sources with complicated geometries, the effect of each of these mechanisms on the heat transfer process can be quite difficult to calculate. … [Read more...]

Thermal management of telecommunications cabinets

September 1, 1997 Renée Estes

Figure 1. Thermal analog model of an OSP enclosure Introduction Over the past twenty years, telecommunications electronics have become increasingly decentralized - moving ever furtherfrom the controlled and protected environment of the Central Office intothe Outside Plant (OSP). The OSP environment contains rain and humidity,dust and pollutants, significant daily and annual … [Read more...]

Standardizing heat sink characterization for forced convection

September 1, 1997 Christian L. Belady, P.E.

Figure 1. Wind tunnel configuration Introduction While there has been a flurry of activity inliterature addressing the behavior of heat sinks in computer electronics,the reusability of the data presented in these papers has been somewhatlimited for two reasons: 1) The data presented is application specific. 2) There has never been a standard method for characterizing … [Read more...]

One-dimensional heat flow

September 1, 1997 Bruce Guenin

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face. Each face is at a uniform temperature. There is no heat flow out of the sides of the object. The cross- sectional area of the object in the direction of heat … [Read more...]

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