Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy efficiency is an increasing concern. In fact, the standard implementation of air-cooled designs results in cooling energy … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
Heat Spreading: Not a Trivial Problem
Introduction Heat spreading is essentially area enlarging: the larger the area, the more heat can be removed at the same temperature difference (subject to certain limits). Unfortunately, except for the simplest of cases, the equations describing heat spreading physics do not have an explicit mathematical solution. Hence, we have to rely on clever approximations or suitable … [Read more...]
Modeling Multiple Heat Source Problems In Electronic Systems
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts (such as, we have already attained a level of power density that is comparable to nuclear power stations) would not … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
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