When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and minimum thermal resistance (in order to maximize the heat losses). Minimization of heat losses may be important for a research environment. Maximum Joule … [Read more...]
Vibration Analysis For Electronic Equipment
This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the design cycle with specific targets/budgets. As with junction temperature requirements in a thermal design, there are structural dynamic issues that need to be … [Read more...]
"Revolutionary" New Thermal Management Materials
Editors tend to frown on use of "revolutionary" in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with low coefficients of thermal expansion (CTEs) and thermal conductivities higher than that of copper (400 W/m K), and a score with thermal conductivities at least … [Read more...]
CFD Simulations in Electronic Systems: A Lot of Pitfalls and a Few Remedies
Introduction In the past 15 years, we have observed a significant increase in the use of Computational Fluid Dynamics (CFD) codes to calculate the thermal behavior of electronic systems. The benefits are undisputed when it comes to performing parametric studies in early design phases. However, when the objective is accuracy, the discussion about what we can expect in practice … [Read more...]
Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch
Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing the cooling system for an electronic product can involve juggling many design parameters, such as airflow rate, fan and vent … [Read more...]
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