Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink. One effective method of increasing thermal capacitance is to include a material that undergoes a change of … [Read more...]
Review of Low Profile Cold Plate Technology for High Density Servers
Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor) was the main reason. As chip powers continue to increase, water cooling appears likely to become mainstream again. In the current market, the … [Read more...]
Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting on a fin and the dimensions of the fin, the thermal resistance of an individual fin is given by: where Af and η are the surface area and … [Read more...]
Solve Thermal Issues Earlier in Updated Board Designs
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded; an approach that can save significant time and money. Unfortunately, we cannot rely solely on previous work because the interaction of old functions and new features … [Read more...]
ASHRAE Committee Formed to Establish Thermal Guidelines for Datacom Facilities
Introduction The environment of every data center is complex and unique. Air currents within the data center have hot and cold air streams colliding, cold air exhausting upward from perforated tiles, hot air streams exhausting from tops and the rear of servers and storage racks. Not only are these air circulation patterns extremely complex, they can also be transient in nature … [Read more...]
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