Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
Simplified Transient Model for IC Packages
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many times in which it is useful to know how rapidly the temperature of the chip changes when the applied power changes abruptly. This month's column presents a simple … [Read more...]
There's something for everybody on talk radio
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. "Herbie in Hereford," I greeted the caller, "You're on the air with Hot Air." "First time caller, long time listener . . .," the caller said. "Wow. There must be an insomnia epidemic," I interrupted. Johnny, the … [Read more...]
Thermal joint conductance for graphite materials
The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete parts of the interface. Therefore, the actual contact area of pressed surfaces represents a very small fraction of the … [Read more...]
Effects of electrical noise on thermocouple measurements
Measurements of temperature in electronic equipment and in thermal characterization apparatus are most often made with thermocouples. As with any sensor, the goal is to gather information about the environment in the vicinity of the sensor, in this case the temperature. Unfortunately the environment around the entire instrumentation chain, including the lead wires and the data … [Read more...]
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