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Packaging Challenges For High Heat Flux Devices

 

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]

So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages

 

Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]

Thermal Conductivity of Solders

 

Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and characteristics of solders that are of interest to the electronics community at large, one of the most significant physical properties to a thermal engineer … [Read more...]

Direct Die Attach Using a Room Temperature Soldering Process

 

As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance along the heat conduction path comes from the thermal interface material (TIM) used between the surfaces of the silicon die and the heat spreader or heat sink. … [Read more...]

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