For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an intricate set of interrelationships between a large number of hardware and software vendors who balance cooperative and competitive market strategies. Key elements in … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
Integrated thermal network models are still useful
Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the need to predict integrated systemperformance on the basis of the individual component … [Read more...]
