The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as equally important; another 21% indicated that cooling was their major challenge; and 12% cited power consumption as a big concern [2]. Another … [Read more...]
Thermo-Reflectance Thermography For Submicron Temperature Measurements
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal of heat generated by various internal system components has become a major design challenge, further complicated by the lack of knowledge of the temperature … [Read more...]
Thermal Properties Of Building Materials
Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some of which are used in heat transfer laboratory environments, in addition to their usual construction applications. Knowledge of thermal conductivity … [Read more...]
Advanced Cooling Using Meso-Scale Evaporative Cold Plates
Introduction Thermal management of servers and communications equipment has become significantly more challenging over the past several years. As is well known, processor powers have increased to 150 W or more and are projected to continue to rise, despite the move to multi-core designs (and the huge investment in software that this entails) [1]. Rack-level functional density … [Read more...]
A Practical Implementation Of Silicon Microchannel Coolers
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were very high. As chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. Due to … [Read more...]
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