Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a 'design for manufacturability' methodology for forced convection cooled, plate fin arrays used to form high performance heat sinks for electronics cooling applications. In … [Read more...]
Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number
Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various industrial and automotive applications. Use of high thermal conductivity metallic nanoparticles (e.g., copper, aluminum, silver, gold, etc.) … [Read more...]
Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude
Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided by the aircraft, routed to and blown across the electronics. However, in some applications potential contaminants in the cooling air, … [Read more...]
Thermal Strain In Semiconductor Packages, Part I
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]
Top 20 Considerations For Selecting Thermal Interface Materials
Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly. Thermal interfaces are usually an afterthought to designs but play a huge factor in the performance and reliability to a … [Read more...]
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