Articles Archives | Page 125 of 176

In the data center, power and cooling costs more than the it equipment it supports

February 1, 2007 Christian L. Belady, P.E.

Historically, the cost of energy and the cost of the data center power and cooling infrastructure have not been on the radar for most Chief Financial Officers (CFO) and Chief Information Officers (CIO) and have not been considered in TCO (Total Cost of Ownership) models. As a result, almost all of the focus has been on driving down the cost of IT equipment in the data center. … [Read more...]

Adhesion of Thermal Interface Materials for CPU Heatsinks, an Overlooked Issue

February 1, 2007 Margaret B. Stern

High performance thermal interface materials (TIMs) inserted between the CPU lid and heatsink - generally referred to as the "TIM2" - provide a reworkable low resistance thermal path in the package stack-up. It is well-recognized that users need to monitor the thermal performance of the TIMs to verify vendor data [1, 2]. Less well-known is that the TIM2 can also mechanically … [Read more...]

Using a simple air recirculation model to explore computer rack cooling

February 1, 2007 Robert E. Simons

Figure 1. Schematic diagram of simple computer rack air recirculation model. Figure 2. Schematic diagram of computer rack air recirculation model with heat exchanger in rear of computer rack. In an article in the November 2006 issue of ElectronicsCooling it was noted that “advances in computer clusters have resulted in the introduction of higher density server … [Read more...]

Thermal conductivity of common alloys in electronics packaging

February 1, 2007 Jim Wilson, Ph.D.

Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar 17 5.9 Alloy42 12-15 4-6 Invar + … [Read more...]

Effect Of Improved Thermoelectric Zts On Electronic Module Coolability

November 1, 2006 Robert E. Simons

In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to address the chip hot spot problem. Effort has been directed towards the development of new bulk materials and thin film micro-coolers. The usefulness of … [Read more...]

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