Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
Compact thermal modeling in electronics design
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or … [Read more...]
About viscosity
Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that this fluid parcel deforms. This type of deformation is called shear. The ability to withstand shear is a material property called the dynamic viscosity m. The viscosity … [Read more...]
Piezo actuators for electronics cooling
Introduction Today, there is a specific demand by the electronics consumer market: more devices using low power processors with multiple simultaneous CPU functions. Due to the significant demand in computing needs, the International Technology Roadmap for Semiconductors (ITRS) 2005 predicts an increase in the overall power consumption for some platforms [1]. The cooling issues … [Read more...]
Microscale heat transfer
Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick. Ever increasing demand for faster microprocessors and the continuous trend to pack more transistors on a … [Read more...]
- « Previous Page
- 1
- …
- 122
- 123
- 124
- 125
- 126
- …
- 176
- Next Page »
