Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided by the aircraft, routed to and blown across the electronics. However, in some applications potential contaminants in the cooling air, … [Read more...]
Thermal Strain In Semiconductor Packages, Part I
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]
Estimating the effect of intercoolers for computer rack cooling
Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner article addressed the use of a water-cooled air-to-liquid heat exchanger to reduce computer rack air exhaust temperatures and mitigate the effect of … [Read more...]
Developments with metallic thermal interface materials
Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
Compact thermal modeling in electronics design
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or … [Read more...]
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